Description
If you need to heat sink a SoC, motor driver, linear regulator, FET or other surface-mount package part, this extra-tall, extra-small mini heat sink is an ideal solution. It provides an extra thermal boost with an easy-to-use design.
The heat sink measures 0.26" x 0.26" (6.75mm x 6.75mm) square with three tall fins extending 0.39" (10mm) high. The height can be reduced by filing if necessary to fit in tighter cases. Thermal tape is included on the bottom for easy attachment. Perfect for medium flat BGAs, TSSOPs, QFNs, and similar packages.
Note: As of October 20th, 2017, a variant with size changes and three fins (instead of nine) is shipped, including thermal tape on the bottom.
- Dimensions: 6.75mm x 6.75mm x 10mm (0.26" x 0.26" x 0.39")
- Weight: 0.6 g
- Thermal resistance approximately 80ºC/W
- Includes thermal tape for easy mounting